Precision machining refers to a general term for machining accuracy and surface finish exceeding those of conventional finishing methods. It mainly includes precision cutting (such as diamond boring and precision turning) and high-precision grinding. Its machining accuracy is typically 10~0.1μm, with a tolerance grade of IT5 or higher, and a surface roughness Ra below 0.1μm. This process requires high-precision machine tools and finely ground cutting tools, achieving high-precision machining through extremely small depths of cut and feed rates. In semiconductor laser processing equipment, it applies technologies such as laser scribing, marking, and debonding, and involves the design and manufacturing of high-precision optical systems.
This process encompasses technologies such as precision stamping of semiconductor lead frames and machining of aero-engine blades. my country has achieved sub-nanometer-level machining accuracy for optical components, breaking through core technologies such as magnetorheology and ion beam polishing equipment. Policy initiatives propose breakthroughs in key technologies for precision forming and lightweight material processing, forming a collaborative innovation system of materials, processes, and applications in the automotive lightweighting field. Ion beam polishing machines have achieved a minimum controllable material removal rate of 0.1 nanometers, providing technical support for major national science and technology projects such as integrated circuit manufacturing.
